Thermaltake Technology Memory Cooling Kit

Thermaltake Technology Memory Cooling Kit
27.11.2003
Thermaltake Technology, developed the first Memory Cooling Kit, it has become almost a necessity when searching for RAM memory Nov., 2003 - Taipei, Taiwan - Ever since the leading thermal solution manufacturer, Thermaltake Technology, developed the first Memory Cooling Kit, it has become almost a necessity when searching for RAM memory. Majority of today's high-end RAM memories are pre-installed with some degree of cooling solution to allow the chips to run at a more stable state. Thermaltake is proud to announce their next generation of Memory Cooling Kits: RAMsink. Al RAMsink Cu RAMsink Package View According to Thermaltake, this design concept is proven to be more effective in terms of heat dissipation and more user friendly thanks to its small size. RAMsink is to be released with 2 available models: Aluminum RAMsinks & Copper RAMsinks. Each model will come with high quality industrial double-coated thermal tape (3M 9448B) to ensure that all RAMsink can be secured onto the chip securely and maximum contact is achieved. Aside from what the name implies, RAMsink can also be applied onto any chipset or MOFSET. Related Link: http://www.thermaltake.com/coolers/memory/ramsink.htm Availability: RAMsink Series Memory Cooling Kit will be available worldwide in December of 2003. Visit www.thermaltake.com for more detail specification and information. About ThermalTake Thermaltake Incorporation, located in Walnut, CA is the global leader Thermal Solution and Thermal Management for PC & Industrial Market. Its Engineering Staffs masters in Airflow Analysis, Material Conductivity and Heat Dissipation Efficiency. Thermaltake offers a wide range of products and services, providing effective and cost-conscious cooling devices. The Company has more than 1,000 employees worldwide supporting customers from its headquarters in Taipei, Taiwan, as well as from offices in China, Europe and United States Continent